A feasibility study is herein attempted, towards the
adaptation of modern surface-mount device (SMD) prototyping
practice to learning environments. This necessity emerges not
only from the profound advantages of the above technology (e.g.
component size, availability, low cost etc.) but also from the fact
that contemporary designs often require special board layout
considerations, which may be in compatible with through-hole
components. In addition, the long process between prototyping
and product finalization can be greatly shortened. Nevertheless,
the employment of surface-mount techniques in education may
be discouraged by both the unappealing part sizes (i.e. handling
difficulty) and the excessive cost of commercial supporting
equipment. The main objective of this study is to suggest
practical and low-cost solutions for all different SMD
prototyping/manufacturing stages, which can demystify and
render this procedure welcome and easily applicable in
laboratory classes. 
A feasibility study is herein attempted, towards the
adaptation of modern surface-mount device (SMD) prototyping
practice to learning environments. This necessity emerges not
only from the profound advantages of the above technology (e.g.
component size, availability, low cost etc.) but also from the fact
that contemporary designs often require special board layout
considerations, which may be in compatible with through-hole
components. In addition, the long process between prototyping
and product finalization can be greatly shortened. Nevertheless,
the employment of surface-mount techniques in education may
be discouraged by both the unappealing part sizes (i.e. handling
difficulty) and the excessive cost of commercial supporting
equipment. The main objective of this study is to suggest
practical and low-cost solutions for all different SMD
prototyping/manufacturing stages, which can demystify and
render this procedure welcome and easily applicable in
laboratory classes.
For more detail: Surface-mount device prototyping in education
