Advantech, a leading global provider of IoT systems and embedded platforms, is pleased to announce the latest 3.5″ SBC MIO-5393 powered by 9th Gen. Intel® Xeon®/Core™. Featuring a compact 146 x 102 mm (5.78 x 4.01 in) design, this single board computer offers impressive I/O functionality and domain-focused features like CANBus. Advantech’s embedded small form-factor SBC’s are designed to support wide operating temperature ranges (-40 ~ 85°C / -40 ~ 185°F) and harsh environments, making it an excellent choice for applications that require high processing speeds, such as Automated optical inspection machines, passenger information systems, outdoor kiosks, surveillance and medical devices.
High-performance Computing and Rapid NVMe Storage
Advantech’s platform is the first 3.5″ SBC to feature the latest 9th Gen. Intel® Xeon®/Core™ with six core computing power. This new generation SBC doubles USB speed by utilizing USB 3.2 Gen 2 (10Gbps). Using a built-in Gen9LP graphics engine, MIO-5393 supports three simultaneous displays with 48bit LVDS (eDP optional), HDMI (up to 4k@30Hz), and DisplayPort (up to 4k@60Hz). MIO-5393 supports up to 32GB(64GB*) memory size dual-channel DDR4 2400MHz and features a M.2 M-Key 2280 slot for NVMe/PCIE Gen3x4 high-speed PCIe SSD storage, providing high data rates for computing and storage. This makes the MIO-5393 an excellent solution for performance demanding applications that require computing power in a compact 3.5″ form-factor.
Innovative Thermal Design Supports Wide Operating Temperatures
Advantech’s MIO-5393 features the innovative Quadro Flow Cooling System (QFCS) thermal solution for excellent temperature management. This advanced high-efficiency low profile cooling solution facilitates extreme computing performance. This thin and light thermal solution features a silent fan, enabling heavy CPU loading without CPU speed throttling. MIO-5393 utilizes two different TDP (25W/45W) SKUs with either active or passive heatsink to support extended temperature operation (-40 ~ 85°C / -40 ~ 185°F). Advantech’s advanced thermal-solution leverages four symmetrical screw holes around the CPU to drastically reduce the thermal resistance and to dissipate the heat quickly. Advantech’s 3.5″ SBC effectively solves the temperature and thermal issues confronting outdoor kiosks, railway applications and factory environments.