ELECTRONIC ASSEMBLIES WITHOUT PCBS BUT WITH LASER DIRECT STRUCTURING

Laser direct structuring (LDS) is a special success story. For almost 20 years, it has been possible to apply electronic conductor paths directly onto plastic parts during series production. Laser Direct Structuring (LDS) – The structure of the conductor path is applied using the LDS process.

LDS enables electronic assemblies to be made in flexible geometric shapes. Smart phones, hearing aids and smart watches are becoming smaller and more powerful thanks to this process.

LDS enables the production of electronic assemblies with flexible geometric shapes. This process enables electronic products (such as smart phones, sensors or medical devices) to become even smaller and more powerful. Automated manufacturing processes also make this process more economically attractive.

There is less and less space available for electronic assemblies, so solutions are needed which replace conventional printed circuit boards. LDS enables further miniaturisation and makes increasingly complex geometric designs possible. This is a stable and reliable process that has established itself in quality-critical sectors such as medical technology or safety-relevant components for the automotive industry.

The LDS process enables three-dimensional assemblies Direct laser structuring enables 3D-MID (Mechatronic Integrated Devices) assemblies to be produced. When using 3D-MID, electronic components can be fitted directly onto a three-dimensional base body, without circuit boards or connecting cables. The base body is manufactured using an injection moulding process, whereby the thermoplastic material has a non-conductive, inorganic additive.

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