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ALL IN ONE MULTIMETER LCR READER MPA

ALL-IN-ONE MULTIMETER LCR-READER-MPA

LCR-Reader from Siborg Systems Inc. is an easy-to-use multimeter with automatic measurements. It offers a record high accuracy and unrivaled functionality. The device has reached the finals for Plant Engineering’s Product of the Year 2020 for Maintenance Tools and Equipment. Voting opens on November 12th and the winners will be announced in January 2021. Plant Engineering is an […]

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TEXAS INSTRUMENTS TMAG5124 HALL EFFECT SWITCH SENSOR

TEXAS INSTRUMENTS TMAG5124 HALL-EFFECT SWITCH SENSOR

Texas Instruments TMAG5124 Hall-Effect Switch Sensor is a high-precision Hall effect sensor that offers a 2-wire interface designed for industrial designs. The TMAG5124 integrates a current source that switches between two levels depending on the value of the magnetic field applied to the part. While the high value is fixed, the low value can be selected from two ranges.

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MELEXIS ANNOUNCES WORLD FIRST COMBINED SENSOR FOR SMART TIRES

MELEXIS ANNOUNCES WORLD-FIRST COMBINED SENSOR FOR SMART TIRES

Melexis, a global microelectronics engineering company, has unveiled the MLX91805 smart tire sensor to help OEMs prepare for the forthcoming extension of mandatory tire-pressure monitoring to include commercial vehicles and to enable future generations of smart tires. Specially designed to be embedded in the tire, unlike current rim-mounted TPMS sensors, the MLX91805 TMS integrates an 800g XZ-axis

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HEILIND ELECTRONICS ADDS OMRONS D6T THERMAL SENSOR TO SENSOR PORTFOLIO

HEILIND ELECTRONICS ADDS OMRON’S D6T THERMAL SENSOR TO SENSOR PORTFOLIO

Heilind Electronics, a leading global distributor of electronic components and authorized distributor for Omron, has expanded its sensor offering with the Omron D6T MEMS thermal sensor. The sensor is designed for non-contact temperature measurement and human detection. Designed for target areas between minus 40 degrees and plus 200 degrees Celsius, the miniature D6T thermal sensor uses Omron’s

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KEMET ADVANCES HYBRID ALUMINUM POLYMER CAPACITOR TECHNOLOGY

KEMET ADVANCES HYBRID ALUMINUM POLYMER CAPACITOR TECHNOLOGY

KEMET, a subsidiary of Yageo Corporation (“Yageo”) (TAIEX: 2327) and leading global supplier of electronic components, announces the launch of three hybrid aluminum polymer capacitor series: A780, PHA225, and PHH225. These AEC-Q200 qualified capacitors offer a combination of highly conductive polymer technology and liquid electrolytic material in a hybrid design, resulting in an outstanding electrical

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NEW LIGHT POWERED AI CHIP TRIES TO MIMIC HUMAN BRAIN

NEW LIGHT-POWERED AI CHIP TRIES TO MIMIC HUMAN BRAIN

This light-driven prototype could empower smarter and smaller autonomous technologies like drones and robotics, plus smart wearables and bionic implants like artificial retinas. The study, from an international team of researchers led by RMIT University, is published in the journal Advanced Materials recently. Walia, who also co-leads the Functional Materials and Microsystems Research Group, said. He also added, The prototype

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RYZEN EMBEDDED V2000 WITH AMD RADEON™ PROMISES DOUBLE PERFORMANCE

RYZEN EMBEDDED V2000 WITH AMD RADEON™ PROMISES DOUBLE PERFORMANCE

AMD has announced their new Ryzen Embedded V2000 processors with 7nm fabricated Zen 2 cores. They have designed four new processors for embedded devices. Ryzen Embedded V2000 doubles the multi-threaded performance-per-watt and offers up to 30 percent better single-thread CPU performance compared to the previous-gen V1000. Also, the graphics performance is expected to have a 40 percent boost. The Ryzen Embedded

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BROADCOMS SINGLE SILICON PHOTO MULTIPLIER IS BEST SUITED FOR THE DETECTION OF LOW LEVEL PULSED LIGHT SOURCES

BROADCOM’S SINGLE-SILICON PHOTO-MULTIPLIER IS BEST SUITED FOR THE DETECTION OF LOW-LEVEL PULSED LIGHT SOURCES

The Broadcom® AFBR-S4N33C013 is a single-silicon photo-multiplier (SiPM) used for ultra-sensitive precision measurement of single photons. The active area is 3.0 mm × 3.0 mm. A high packing density of single chips is achieved using through-silicon-via (TSV) technology and a chip-sized package (CSP). Larger areas can be covered by tiling multiple AFBR-S4N33C013 CSPs almost without any edge losses. The

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