devices

OKWS ELEGANT NEW SLIM CASE FOR MOBILE OEM ELECTRONICS

OKW’S ELEGANT NEW SLIM-CASE FOR MOBILE OEM ELECTRONICS

New SLIM-CASE is available in different versions to suit a wide range of applications OKW has launched an innovative and elegant new SLIM-CASE for the latest generation of handheld touchscreen and wireless data transfer devices. Ergonomic SLIM-CASE (IP 54/65) is ideal for measuring and control, wireless communications, IoT/IIoT, healthcare, laboratories, offices, safety engineering and environmental […]

OKW’S ELEGANT NEW SLIM-CASE FOR MOBILE OEM ELECTRONICS Read More »

Two node Pi Zero Cluster with Protostax Enclosure for Raspberry Pi Zero

Exploring Cluster Computing: Raspberry Pi Zero Project Adventure

Build a Raspberry Pi Zero cluster with MPI (Message Passing Interface). Employ parallel computing to discover all prime numbers under 100 million in approximately 24 seconds!   Introduction Raspberry Pis offer an excellent platform for learning programming and experimentation. The Raspberry Pi Zero, being affordable and compact, might seem limited with its single core and

Exploring Cluster Computing: Raspberry Pi Zero Project Adventure Read More »

ADVANTECH LAUNCHES AIMB 218 MINI ITX MOTHERBOARD WITH INTEL ATOM® PROCESSOR FOR AIOT EDGE DEVICES

ADVANTECH LAUNCHES AIMB-218 MINI-ITX MOTHERBOARD WITH INTEL ATOM® PROCESSOR FOR AIOT EDGE DEVICES

Advantech, a global leader in embedded IoT solutions, is pleased to release AIMB-218, a low-profile fanless industrial-grade Mini-ITX motherboard featuring Intel Atom® x6000E, Intel® Pentium®, and Celeron® N and J Series processors. Based on low-power 10nm technology (6 ~ 12W TDP), AIMB-218 supports up to 4 cores with 3.0GHz turbo frequency and up to 850MHz of

ADVANTECH LAUNCHES AIMB-218 MINI-ITX MOTHERBOARD WITH INTEL ATOM® PROCESSOR FOR AIOT EDGE DEVICES Read More »

ROHDE SCHWARZ ENTERS SOURCE MEASURE UNIT MARKET WITH THE NEW RS NGU

ROHDE & SCHWARZ ENTERS SOURCE MEASURE UNIT MARKET WITH THE NEW R&S NGU

With two new source measure units (SMU), Rohde & Schwarz enters a market previously not addressed by the power products of the test and measurement specialist. The performance of the new R&S NGU201 and R&S NGU401 SMUs enables simultaneous sourcing and measuring of currents and voltages with high precision. The two-quadrant R&S NGU201 addresses wireless device battery tests and automatically switches

ROHDE & SCHWARZ ENTERS SOURCE MEASURE UNIT MARKET WITH THE NEW R&S NGU Read More »

TURN KEY ENERGY HARVESTING PMIC MODULE FOR IOT DEVICES

TURN-KEY ENERGY HARVESTING/PMIC MODULE FOR IOT DEVICES

Miniaturization and micro-devices company Xidas has introduced what it says is the industry’s first plug & play, universal energy harvesting and power management module for IoT devices. The EHM-UNIV, says the company, is a small surface-mount energy harvesting and power management module that eliminates the need for engineers to purchase energy harvesting evaluation modules and determine

TURN-KEY ENERGY HARVESTING/PMIC MODULE FOR IOT DEVICES Read More »

Raspberry Pi 5 PCIe connection unlocked via reverse engineering

Raspberry Pi 5 PCIe connection unlocked via reverse engineering

Reverse engineering is a methodical process that involves deconstructing complex systems into simpler parts to gain a comprehensive understanding of how they work. YouTuber “George Smart, M1GEO” has released an interesting video this week providing more details on his process of reverse engineering the Raspberry Pi 5 PCIe connection. The Raspberry Pi 5 compact, single-board computer was

Raspberry Pi 5 PCIe connection unlocked via reverse engineering Read More »

100V HIGH CURRENT PHOTORELAY RELEASED IN DIP4 PACKAGE FOR INDUSTRIAL EQUIPMENT

100V HIGH-CURRENT PHOTORELAY RELEASED IN DIP4 PACKAGE FOR INDUSTRIAL EQUIPMENT

Toshiba Electronics has released a 100 V high-current photorelay, TLP241B for industrial equipment building automation systems and mechanical relay replacements, security systems, heating, ventilation and air conditioning (HVAC), Battery Management System (BMS), etc. Encompassed in a DIP4 package, this new device comprises of a photo MOSFET optically coupled to an infrared light-emitting diode. The ability of TLP241B photorelay to provide an

100V HIGH-CURRENT PHOTORELAY RELEASED IN DIP4 PACKAGE FOR INDUSTRIAL EQUIPMENT Read More »

Scroll to Top