memory

AAEON ANNOUNCES NEW UPCOMING PLATFORMS POWERED BY NVIDIA JETSON EDGE AI PLATFORM PRESENTING SIX SESSIONS AT GTC 2021

AAEON ANNOUNCES NEW UPCOMING PLATFORMS POWERED BY NVIDIA JETSON EDGE AI PLATFORM; PRESENTING SIX SESSIONS AT GTC 2021

AAEON, an industry leader in embedded AI edge computing systems, announces a lineup of platforms currently under development powered by the newly released NVIDIA® Jetson™ TX2 NX system on module (SOM). This range of systems, named the BOXER-823x Series, will augment AAEON’s lineup of diverse solutions powered by the NVIDIA Jetson edge AI platform. With these platforms planned […]

AAEON ANNOUNCES NEW UPCOMING PLATFORMS POWERED BY NVIDIA JETSON EDGE AI PLATFORM; PRESENTING SIX SESSIONS AT GTC 2021 Read More »

KIOXIA WESTERN DIGITAL DEVELOP 162 LAYER 3D NAND

KIOXIA & WESTERN DIGITAL DEVELOP 162-LAYER 3D-NAND

Kioxia Corporation and Western Digital Corp., today announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies’ 20-year joint-venture partnership, this is the companies’ highest density and most advanced 3D flash memory technology to date, utilizing a wide range of technology and manufacturing innovations. Through our strong partnership that

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Experience the Simplicity of Raspberry Pi Imaging with the New Raspberry Pi Imager

Experience the Simplicity of Raspberry Pi Imaging with the New Raspberry Pi Imager

I’m pleased to share that we’ve developed a streamlined new tool for preparing microSD cards with the Raspberry Pi’s operating system software. Called Raspberry Pi Imager, it provides an easier imaging process compared to past methods. Rather than relying on complex command line instructions or third-party disk imaging utilities, our new Imager application handles the

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AAEON PARTNERS WITH KINGTIGER AND AMI TO ACCELERATE DEPLOYMENT OF IMS MEMORY ERROR PREVENTION SOFTWARE

AAEON PARTNERS WITH KINGTIGER AND AMI TO ACCELERATE DEPLOYMENT OF IMS MEMORY ERROR PREVENTION SOFTWARE

AAEON, an industry leader in edge computing solutions, collaborated with KingTiger, a leader in memory testing solutions, to help with testing and developing their intelligent Memory Surveillance (iMS) memory error prevention software. Developed in conjunction with AMI, a leading provider of firmware, manageability and security solutions for the global computing industry, this innovative software, which is embedded in

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MORE FLEXIBILITY AND HIGHER I O SPEEDS MEET THE NEW USB2IO INTERFACE EXPLORER

MORE FLEXIBILITY AND HIGHER I/O SPEEDS? MEET THE NEW USB2IO INTERFACE EXPLORER

USB2IO is a high-tech interface device that is fully powered by USB and totally dependent on STMicro STM32H7 MCU and Intel Cyclone 10 FPGA. It is an FPGA-based multi-I/O device that offers ease of working with various electronic devices using common interfaces. It is designed towards helping engineers and embedded developers communicate with various breakout boards and functional hardware

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GRA115Q 3U VPX GPU BOARD FOR INTENSIVE RADAR AND AI APPLICATIONS

GRA115Q 3U VPX GPU BOARD FOR INTENSIVE RADAR AND AI APPLICATIONS

The GRA115Q 3U VPX is a GPU board for applications like radar and video analysis. It is a good option for systems that require high-performance graphical computations with compatible advanced GPUs. The General Purpose GPU board is based on NVIDIA Turing architecture that comes with dedicated tensor cores for accelerating deep learning inferences. Hence, it could be a good

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VECOW SPC 7000 7100 – COMPACT AND FANLESS TIGER LAKE UP3 EMBEDDED BOX PC FOR AI RELATED APPLICATIONS

VECOW SPC-7000/7100 – COMPACT AND FANLESS TIGER LAKE UP3 EMBEDDED BOX PC FOR AI-RELATED APPLICATIONS

Barely a month after Vecow introduced the SPC-6000 fanless embedded PC powered by an Atom x6425RE Elkhart Lake processor, the company is back to announce another ultra-compact fanless embedded box PC aimed at delivering powerful computing performance and outstanding graphics to meet the demands of the fast-growing AI-related applications. Vecow SPC-7000/7100 box PC is powered by the latest 11th Gen Intel® Core™ i7/i5/i3 processor (Tiger

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MAJOR BREAKTHROUGH IN CHIP ARCHITECTURE TECHNOLOGY

MAJOR BREAKTHROUGH IN CHIP ARCHITECTURE TECHNOLOGY

Engineers at EPFL’s Laboratory of Nanoscale Electronics and Structures (LANES) have developed these next-generation circuits that allow for smaller, faster, and more energy-efficient devices. This technology is the first to implement a 2-D material called a logic-in-memory architecture. It is a special kind of a single architecture that integrates logic operations with a memory function. Traditionally,

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