memory

SAMSUNG DEVELOPS INDUSTRY’S FIRST 3RD GENERATION 10NM CLASS DRAM

SAMSUNG DEVELOPS INDUSTRY’S FIRST 3RD-GENERATION 10NM-CLASS DRAM

New 8Gb DDR4 Based On Most Advanced 1z-Nm Process Enables DRAM Solutions With Ultra-High Performance And Power Efficiency. Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed a 3rd-generation 10-nanometer-class (1z-nm) eight-gigabit (Gb) Double Data Rate 4 (DDR4) DRAM for the first time in the industry. In just 16 months since it began

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LATEST TYSOM KIT ACCELERATES THE DEVELOPMENT OF AI

LATEST TYSOM KIT ACCELERATES THE DEVELOPMENT OF AI

Aldec’s TySOM-3A-ZU19EG embedded system development board, showcased at Embedded World 2019, supports the early co-development and co-verification of hardware and software. Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the TySOM-3A-ZU19EG, to assist in the development of AI, Deep-learning Neural Network (DNN) and other applications

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CYPRESS SEMICONDUCTOR SERIAL FRAM NONVOLATILE MEMORY DEVICES

CYPRESS SEMICONDUCTOR SERIAL FRAM NONVOLATILE MEMORY DEVICES

Cypress Semiconductor Serial F-RAM (ferroelectric RAM) memories combine the nonvolatile data storage capability of ROM with the fast speeds of RAM. Serial F-RAM features a variety of interface and density options, including SPI and I2C interfaces, industry-standard packages, and densities ranging from 4KB to 4MB. Cypress Serial F-RAMs have three distinct advantages over other nonvolatile

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TOSHIBA MEMORY EUROPE UNVEILS 1TB SINGLE PACKAGE PCIE GEN3 X4L SSDS

TOSHIBA MEMORY EUROPE UNVEILS 1TB SINGLE PACKAGE PCIE GEN3 X4L SSDS

Toshiba Memory Europe announced the introduction of the fourth generation of its single package ball grid array (BGA) solid state drive (SSD) BG4 series at CES 2019. Toshiba Memory’s new line-up of ultra-compact NVMe™ SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and

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JOINING THE RISC V RANKS IBM’S POWER ISA TO BECOME FREE

JOINING THE RISC-V RANKS: IBM’S POWER ISA TO BECOME FREE

IBM’s Power processor architecture is probably best known today as those humongous chips that power everything from massive mainframes and supercomputers to slightly less massive mainframes and servers. Originally developed in the 1980s, Power CPUs have been a reliable presence in the market for decades, forming the backbone of systems like IBM’s RS/6000 and AS/400

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Rohde Schwarz is expanding its portfolio with the RTC1000 RTM3000 and RTA4000 series oscilloscopes

Rohde & Schwarz is expanding its portfolio with the RTC1000, RTM3000 and RTA4000 series oscilloscopes

The new R&S®RTC1000 series oscilloscope Rohde & Schwarz is again expanding its oscilloscope portfolio with the launch of the R&S®RTC1000, R&S®RTM3000 and R&S®RTA4000 series oscilloscopes. With this market introduction Rohde & Schwarz has now the most up-to-date 1000, 2000, 3000 and 4000 class instruments on the market. The new R&S®RTC1000 series oscilloscope features the highest

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