A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH-PERFORMANCE CHIP COOLING
At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance chip for cooling the latter one achieves a low total thermal resistance of 0,34K/W to 0.28K/W at […]
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