processes

BOURNS LAUNCHES ULTRA-LOW 0.15 PSI PRESSURE SENSOR

Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the expansion of its line of environmental sensors adding an ultra-low 0.15 to 1.0 PSI pressure sensor. Bourns® Models BPS110/BPS120 pressure sensors are based on state-of-the-art Micro-Electro-Mechanical Systems (MEMS) technology, which provides extremely accurate condition readings in a miniature package size. Designed to deliver superior performance in applications where …

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A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH-PERFORMANCE CHIP COOLING

At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance chip for cooling the latter one achieves a low total thermal resistance of 0,34K/W to 0.28K/W at …

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