An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maint... Read more
Hardware components: Walabot × 1 Raspberry Pi 2 Model B For Walabot, RPI v3 is preferable. × 1 Android device Samsung Galaxy A3 or better. × 1 Intocircuit 26000mAh High Capacity Power Castle... Read more
Let’s build an IoT device that sends flame sensor data to SAMI using SAMI’s WebSockets. The IoT device consists of an off-the-shelf sensor, Arduino UNO and Raspberry Pi. In this... Read more
