samsung

SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy …

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Make a fire detector in minutes with Samsung SAMIIO, Arduino UNO and Raspberry Pi

Let’s build an IoT device that sends flame sensor data to SAMI using SAMI’s WebSockets. The IoT device consists of an off-the-shelf sensor, Arduino UNO and Raspberry Pi. In this implementation, a Simple Manifest is used to create a new device type quickly. Then you can easily connect the IoT device to SAMI, and start …

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