µPOL DC-DC converters bring highest power density to space-constrained apps
TDK Corporation announces the new series of µPOL™ DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise.
Rather than using side by side discrete integrated circuit (IC) and discrete inductor (L) the new FS series integrates the IC and inductor in a compact configuration which offers a high-density solution for space-constrained applications requiring a low-profile power source.
At 3.3 x 3.3 x 1.5 mm, they minimize the required external components, retaining the highest possible performance while offering a simplified design for ease of integration. This family can deliver a high density solution of 1 watt per mm3, while offering 50% less solution size than the other products available in its class. As a result, this minimizes system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs. It operates at a broad junction temperature range, from -40 °C to 125 °C. Mass production of FS1406 is expected to begin in Q3 2019.
TDK has been developing patents related to these innovations (US 9,729,059 and US 10,193,442) over several years. µPOL™ were developed by TDK’s group company Faraday Semi. These new solutions incorporate high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.