3d

SAMSUNG UNVEILS 12 LAYER 3D TSV CHIP PACKAGING TECHNOLOGY

SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy

SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY Read More »

CREALITY WIFI TAKES ON OCTOPRINT

CREALITY WIFI TAKES ON OCTOPRINT

A very common hack to a 3D printer is to connect a Raspberry Pi to your printer and then load Octoprint or a similar program and send your files to the printer via the network. [Teaching Tech] noticed that Creality now has an inexpensive WiFi interface that promises to replace Octoprint and decided to give it a

CREALITY WIFI TAKES ON OCTOPRINT Read More »

NEW CONGATEC SMARC MODULE WITH NXP I.MX 8M MINI PROCESSOR 1

NEW CONGATEC SMARC MODULE WITH NXP I.MX 8M MINI PROCESSOR

congatec – a leading vendor of standardized and customized embedded computer boards and modules – today introduces a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts¹ due to the new 14nm FinFET structure. The module also offers impressive visualization capabilities – including 3D graphics with full-HD resolution – despite low

NEW CONGATEC SMARC MODULE WITH NXP I.MX 8M MINI PROCESSOR Read More »

Scroll to Top