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Pie

Four Pies

We give you a quick overview and build a project to welcome the Raspberry Pi 4 to the world! Overview Below a quick overview of the content. Introduction and showcase video Pie Pi 3.14 Pies Result Introduction and showcase video To welcome and celebrate the new Raspberry Pi 4, we’re building a project consisting of …

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THERMAL-PACKAGED MOSFET TARGETS E-BIKE POWER SYSTEMS

THERMAL-PACKAGED MOSFET TARGETS E-BIKE POWER SYSTEMS

Analog and mixed-signal semiconductor company MagnaChip Semiconductor (Cheongju-si, South Korea) has announced the release of a 100-V mid-voltage MOSFET with a new thermal package designed for the fast-growing electric bike (e-bike) market. The MOSFET is housed in a M2PAK-7P package suitable to meet the particular requirements of electric bike (e-bike) systems, which are powered by electric motors …

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THE BOXER-8300AI SERIES POWERING AI@EDGE WITH INTEL® MOVIDIUS™ MYRIAD™ X

THE BOXER-8300AI SERIES: POWERING AI@EDGE WITH INTEL® MOVIDIUS™ MYRIAD™ X

AAEON, the award winning industry leader in AI@Edge solutions, announces the launch of the BOXER-8300AI Series. Including the BOXER-8310AI, BOXER-8320AI, and the BOXER-8330AI (Coming Q4 2019), this family of AI@Edge embedded box PCs power AI and edge computing thanks to the innovative IntelÂŽ Movidius™ Myriad™ X. At the core of the BOXER-8300AI series is the innovative AI Core X module from AAEON. Each …

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INCANDESCENT LIGHT BULBS AT THE NANOSCALE

INCANDESCENT LIGHT BULBS AT THE NANOSCALE

Using tiny arrays of carbon nanotubes, a team of researchers at Rice University has designed nanoscale incandescent light source that could be tuned to precisely emit at specific wavelength, based on the materials’ configuration. The so-called nanoscale thermal emitters described in a paper titled “Non‐Hermitian Selective Thermal Emitters using Metal–Semiconductor Hybrid Resonators” published in the journal of …

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ADVANTECH LAUNCHES HIGH-PERFORMANCE COM EXPRESS SOM-5899

ADVANTECH LAUNCHES HIGH-PERFORMANCE COM EXPRESS SOM-5899

Advantech, a world leader in embedded IoT, is pleased to announce the launch of its high-end SOM-5899 series COM Express Type 6 Module designed with 8th and 9th Gen IntelÂŽ Core™ H-series processors. Compared with previous generations, the SOM-5899 is enhanced with six cores for better multithreaded performance in compute-intensive applications. With a dual channel 96GB ECC and non-ECC …

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MITSUBISHI ELECTRIC TO LAUNCH MELDIR THERMAL DIODE INFRARED SENSOR

MITSUBISHI ELECTRIC TO LAUNCH MELDIR THERMAL DIODE INFRARED SENSOR

Accurately detects heat to identify types of heat sources and specific human behavior Mitsubishi Electric Corporation announced that it will launch the Mitsubishi Electric Diode InfraRed sensor (MelDIR), a thermal sensor for applications in the fields of security, heating, ventilation and air conditioning (HVAC) and smart buildings, on November 1. MelDIR accurately distinguishes between humans and …

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QIANLI LC-IRP01 THERMAL VISIBLE MICROSCOPE FOR PCB REPAIR

QIANLI LC-IRP01 THERMAL/VISIBLE MICROSCOPE FOR PCB REPAIR

The QianLi’s 160×120 thermal imaging sensor and 1920×1080 visible sensor combine to make a powerful circuit board repair tool, especially helpful in finding overheating or short-circuit issues. Saelig Co. Inc. has introduced the QianLi LC-IRP01 Thermal Imaging Camera, a diagnostic tool for PCBs which displays heat images to help identify damaged or malfunctioning components or short-circuits.  …

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