Nidec Corporation today announces that one of its subsidiaries, Nidec Copal Corporation, has succeeded in developing the world’s thinnest compact, lightweight camera module for mobile phones. Please see the attached press release from Nidec Copal Corporation for further details.
FOR IMMEDIATE RELEASE
|Nidec Copal Corporation|
| For inquiries, please contact: Hiroyuki Hori
(R&D 6th Dept. Tokyo Technical Center)
|E-mail: [email protected]|
Released on May 11, 2016, in Tokyo, Japan
Nidec Copal Develops World’s Thinnest Compact, Lightweight 16-Megapixel Camera Module for Mobile Phones
Nidec Copal Corporation (the “Company”) hereby announces that it has succeeded in developing a 4.2 mm thin—a new world record—compact, lightweight camera module for mobile phones. The new camera module has a 50% reduced volume compared to the Company’s previous products. This new module, designed to meet the market need for thinner products, is a result of our technological capabilities nurtured through many years of development and manufacturing in the camera shutter and optical product fields.
The camera module features a 16-megapixel sensor—the main pixel count in the recent trend toward higher resolutions—autofocus and a bright F1.9 aperture lens. Furthermore, by adopting a high-resolution optical design adapted for the integrated compact 1.0μm pixel size 1/3.1″ sensor, the Company has reduced the volume of the module by 50% compared to previous products, resulting in a product that combines optical performance with a thin design. Mass production is planned to start in the fall of 2016. Moving forward, the Company will continue to respond to the needs of the market by expanding their lineup of thin and compact products for mobile phones.
For more detail: The smallest camera module for mobile devices
|・Sensor||：1/3.1” 1.0μm 16-megapixel CMOS|
|・Focus distance range||：10cm～INF|
|・Unit size||：8.5mm (H) × 8.5mm (W) × 4.2mm (D)|