3d

GANYMEDE MEMS SPEAKERS CAN BE REGANYMEDE MEMS SPEAKERS CAN BE RETROFITTED INTO STANDARD ENCLOSURESTROFITTED INTO STANDARD ENCLOSURES

GANYMEDE MEMS SPEAKERS CAN BE REGANYMEDE MEMS SPEAKERS CAN BE RETROFITTED INTO STANDARD ENCLOSURESTROFITTED INTO STANDARD ENCLOSURES

USound GmbH’s Ganymede Achelous and Adap MEMS speakers with their compact size of 4.7 mm x 6.7 mm x 1.6 mm are ideal for in-ear headphone designs and wearables such as true-wireless headsets. The perfect addition to traditional speakers, they can be easily retrofitted into standard enclosures to improve treble or implement 3D audio systems. Achelous is

GANYMEDE MEMS SPEAKERS CAN BE REGANYMEDE MEMS SPEAKERS CAN BE RETROFITTED INTO STANDARD ENCLOSURESTROFITTED INTO STANDARD ENCLOSURES Read More »

LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT FACING TIME OF FLIGHT CAMERA

LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT-FACING TIME-OF-FLIGHT CAMERA

With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3™ image sensor chip will play a key role in the front-facing camera of the upcoming LG G8 ThinQ, to be unveiled

LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT-FACING TIME-OF-FLIGHT CAMERA Read More »

ART IMITATES DNA

ART IMITATES DNA

It has recently been possible to pay a service a little bit of money and learn more about your own DNA. You might find out you really aren’t Italian after all or that you are more or less susceptible to some ailments. [Paul Klinger] had his DNA mapped and decided to make a sculpture representing his

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TDK CLAIMS SMALLEST POINT OF LOAD DC DC CONVERTER

TDK CLAIMS SMALLEST POINT-OF-LOAD DC-DC CONVERTER

µPOL DC-DC converters bring highest power density to space-constrained apps TDK Corporation announces the new series of µPOL™ DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise. Rather than using side by side discrete integrated circuit

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